Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

von Hengyu Zhang

436 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

• Reihe: Woodhead Publishing
• ISBN: 9780081025321
• Sprache: Englisch
• Erscheinungsdatum: 15.11.2019
• Größe: 229 x 152 mm
• Verlag: Elsevier Inc