TSV 3D RF Integration

High Resistivity Si Interposer Technology

von Shenglin Ma, Yufeng Jin

292 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

• Reihe: Elsevier
• ISBN: 9780323996020
• Sprache: Englisch
• Erscheinungsdatum: 10.05.2022
• Größe: 235 x 191 mm
• Verlag: Elsevier Inc