Microelectronics Packaging Handbook on CD-ROM

von Eugene J Rymaszewski, Alan G Klopfenstein, R R Tummala

1000 Seiten, CD-ROM

Kurzbeschreibung des Verlags

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Maschinenbau und Werkstoffe Fertigungstechnik und Ingenieurwesen
• ISBN: 9780412085611
• Sprache: Englisch
• Erscheinungsdatum: 31.03.1998
• Größe: 179 x 177 mm
• Verlag: Springer London