Recent Trends in VLSI and Semiconductor Packaging

616 Seiten, Hardcover

Kurzbeschreibung des Verlags

The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("SMART-2024") aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "SMART-2024" seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

• Themen: Informatik und Informationstechnologie Informatik Künstliche Intelligenz (KI)
• ISBN: 9781041017868
• Sprache: Englisch
• Erscheinungsdatum: 06.05.2025
• Größe: 280 x 210 mm
• Verlag: CRC Press
• Herausgegeben von: T Vasudeva Reddy, K Madhava Rao