Semiconductor Packaging

Materials Interaction and Reliability

von Andrea Chen, Randy Hsiao-Yu Lo

218 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Elektronik, Nachrichtentechnik Elektronik
• ISBN: 9781138075405
• Sprache: Englisch
• Erscheinungsdatum: 10.04.2017
• Größe: 234 x 156 mm
• Verlag: CRC Press