Advances in CMP/Polishing Technologies for the Manufacture of Electronic Devices

330 Seiten, Hardcover

Kurzbeschreibung des Verlags

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

• Reihe: William Andrew
• ISBN: 9781437778595
• Sprache: Englisch
• Erscheinungsdatum: 01.12.2011
• Größe: 239 x 156 mm
• Verlag: Elsevier Inc
• Herausgegeben von: Syuhei Kurokawa, Toshiro Doi, Ioan D. Marinescu