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| Reihe | The Springer International Series in Engineering and Computer Science |
|---|---|
| ISBN | 9781461349891 |
| Sprache | Englisch |
| Erscheinungsdatum | 14.10.2012 |
| Genre | Technik/Maschinenbau, Fertigungstechnik |
| Verlag | Springer US |
| Lieferzeit | Lieferbar in 6 Werktagen |
| Herstellerangaben | Anzeigen Springer Nature Customer Service Center GmbH ProductSafety@springernature.com |
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
| Reihe | The Springer International Series in Engineering and Computer Science |
|---|---|
| ISBN | 9781461349891 |
| Sprache | Englisch |
| Erscheinungsdatum | 14.10.2012 |
| Genre | Technik/Maschinenbau, Fertigungstechnik |
| Verlag | Springer US |
| Lieferzeit | Lieferbar in 6 Werktagen |
| Herstellerangaben | Anzeigen Springer Nature Customer Service Center GmbH ProductSafety@springernature.com |
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