Failure Analysis of Integrated Circuits

Tools and Techniques

255 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

• Reihe: The Springer International Series in Engineering and Computer Science
• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Maschinenbau und Werkstoffe Materialwissenschaft Technische Anwendung von elektronischen, magnetischen, optischen Materialien
• ISBN: 9781461372318
• Sprache: Englisch
• Erscheinungsdatum: 09.11.2012
• Größe: 23.5 x 15.5 cm
• Verlag: Springer US
• Herausgegeben von: Lawrence C. Wagner