Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

von E-H Wong, Y -W Mai

482 Seiten, Hardcover

Kurzbeschreibung des Verlags

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Maschinenbau und Werkstoffe Materialwissenschaft Festkörpermechanik
• ISBN: 9781845695286
• Sprache: Englisch
• Erscheinungsdatum: 22.05.2015
• Größe: 241 x 164 mm
• Verlag: Elsevier Science