New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

von Nabil Shovon Ashraf, Shawon Alam, Mohaiminul Alam

72 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

• Reihe: Synthesis Lectures on Emerging Engineering Technologies
• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Technologie, allgemein Ingenieurswesen, Maschinenbau allgemein
• ISBN: 9783031008993
• Sprache: Englisch
• Erscheinungsdatum: 16.02.2016
• Größe: 23.5 x 19.1 cm
• Verlag: Springer International Publishing