International Congress and Workshop on Industrial AI and eMaintenance 2023

801 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

This proceedings brings together the papers presented at the International Congress and Workshop on Industrial AI and eMaintenance 2023 (IAI2023). The conference integrates the themes and topics of three conferences: Industrial AI & eMaintenance, Condition Monitoring and Diagnostic Engineering Management (COMADEM) and, Advances in Reliability, Maintainability and Supportability (ARMS) on a single platform. This proceedings serves both academy and industry in providing an excellent platform for collaboration by providing a forum for exchange of ideas and networking.

 

The 21st century has seen remarkable progress in Artificial Intelligence, with application to a variety of fields (computer vision, automatic translation, sentiment analysis in social networks, robotics, etc.) The IAI2023 focuses on Industrial Artificial Intelligence, or IAI. The emergence of industrial AI applications holds tremendous promises in terms of achieving excellence and cost-effectiveness in the operation and maintenance of industrial assets. Opportunities in Industrial AI exist in many industries such as aerospace, railways, mining, construction, process industry, etc. Its development is powered by several trends: the Internet of Things (IoT); the increasing convergence between OT (operational technologies) and IT (information technologies); last but not least, the unabated fast-paced developments of advanced analytics. However, numerous technical and organizational challenges to the widespread development of industrial AI still exist.

 

The IAI2023 conference and its proceedings foster fruitful discussions between AI creators and industrial practitioners.

• Reihe: Lecture Notes in Mechanical Engineering
• Themen: Informatik und Informationstechnologie Computernetzwerke und maschinelle Kommunikation
• ISBN: 9783031396182
• Sprache: Englisch
• Erscheinungsdatum: 02.01.2024
• Größe: 23.5 x 15.5 cm
• Verlag: Springer International Publishing
• Herausgegeben von: Uday Kumar, Ramin Karim, Diego Galar, Ravdeep Kour