Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3

567 Seiten, Hardcover

Kurzbeschreibung des Verlags

This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

• Reihe: Lecture Notes in Electrical Engineering
• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Elektronik, Nachrichtentechnik Elektronik Schaltkreise und Komponenten (Bauteile)
• ISBN: 9783032203175
• Sprache: Englisch
• Erscheinungsdatum: 27.03.2026
• Größe: 23.5 x 15.5 cm
• Verlag: Springer International Publishing
• Herausgegeben von: Vikrant Bhateja, Xin-She Yang, Hai Van Pham, Zaid Omar