Analysis, Architectures and Modelling of Embedded Systems

Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009, Proceedings

315 Seiten, Hardcover

Kurzbeschreibung des Verlags

This book presents the technical program of the International Embedded Systems Symposium (IESS) 2009. Timely topics, techniques and trends in embedded system design are covered by the chapters in this volume, including modelling, simulation, verification, test, scheduling, platforms and processors. Particular emphasis is paid to automotive systems and wireless sensor networks. Sets of actual case studies in the area of embedded system design are also included. Over recent years, embedded systems have gained an enormous amount of proce- ing power and functionality and now enter numerous application areas, due to the fact that many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations. Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever more demanding customer requirements. Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly. Embedded system designers have to cope with multiple goals and constraints simul- neously, including timing, power, reliability, dependability, maintenance, packaging and, last but not least, price.

• Reihe: IFIP Advances in Information and Communication Technology
• Themen: Informatik und Informationstechnologie Informatik Künstliche Intelligenz (KI)
• ISBN: 9783642042836
• Sprache: Englisch
• Erscheinungsdatum: 04.09.2009
• Größe: 23.5 x 15.5 cm
• Verlag: Springer Berlin
• Herausgegeben von: Achim Rettberg, Mauro C. Zanella, Michael Amann, Michael Keckeisen, Franz J. Rammig