Hybrid photonic assemblies based on 3D-printed coupling structures

von Yilin Xu

292 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).

• Reihe: Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ)
• ISBN: 9783731512738
• Sprache: Englisch
• Erscheinungsdatum: 24.04.2023
• Genre: Technik/Elektronik, Elektrotechnik, Nachrichtentechnik
• Verlag: KIT Scientific Publishing