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Hybrid photonic assemblies based on 3D-printed coupling structures
292 Seiten, Taschenbuch
€ 50,40
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| Reihe | Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ) |
|---|---|
| ISBN | 9783731512738 |
| Sprache | Englisch |
| Erscheinungsdatum | 24.04.2023 |
| Genre | Technik/Elektronik, Elektrotechnik, Nachrichtentechnik |
| Verlag | KIT Scientific Publishing |
| Lieferzeit | Lieferbar in 6 Werktagen |
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
| Reihe | Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ) |
|---|---|
| ISBN | 9783731512738 |
| Sprache | Englisch |
| Erscheinungsdatum | 24.04.2023 |
| Genre | Technik/Elektronik, Elektrotechnik, Nachrichtentechnik |
| Verlag | KIT Scientific Publishing |
| Lieferzeit | Lieferbar in 6 Werktagen |
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