ETG-Fb. 173: CIPS 2024

13th International Conference on Integrated Power Electronics Systems, March, 12 – 14, 2024, Düsseldorf, Germany

730 Seiten, CD-ROM

Kurzbeschreibung des Verlags

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration). CIPS is consequently focused on the following main aspects: - assembly and interconnect technology for power electronic devices and converters - integration of hybrid systems and mechatronic systems with high power density - systems´ and components‘ operational behaviour and reliability

• Reihe: ETG-Fachberichte
• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Elektronik, Nachrichtentechnik Elektronik Schaltkreise und Komponenten (Bauteile)
• ISBN: 9783800762880
• Sprache: Englisch
• Erscheinungsdatum: 17.06.2024
• Größe: 14 x 12.4 cm
• Verlag: VDE VERLAG
• Herausgegeben von: VDE ETG