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Network-on-Chip Architectures
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| Reihe | Lecture Notes in Electrical Engineering |
|---|---|
| Themen | Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Elektronik, Nachrichtentechnik Elektronik Schaltkreise und Komponenten (Bauteile) |
| ISBN | 9789048130306 |
| Sprache | Englisch |
| Erscheinungsdatum | 07.10.2009 |
| Größe | 23.5 x 15.5 cm |
| Verlag | Springer Netherland |
| Lieferzeit | Lieferung innerhalb von 28 Werktagen |
| Herstellerangaben | Anzeigen Springer Nature Customer Service Center GmbH Europaplatz 3 | DE-69115 Heidelberg ProductSafety@springernature.com |
[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.
| Reihe | Lecture Notes in Electrical Engineering |
|---|---|
| Themen | Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Elektronik, Nachrichtentechnik Elektronik Schaltkreise und Komponenten (Bauteile) |
| ISBN | 9789048130306 |
| Sprache | Englisch |
| Erscheinungsdatum | 07.10.2009 |
| Größe | 23.5 x 15.5 cm |
| Verlag | Springer Netherland |
| Lieferzeit | Lieferung innerhalb von 28 Werktagen |
| Herstellerangaben | Anzeigen Springer Nature Customer Service Center GmbH Europaplatz 3 | DE-69115 Heidelberg ProductSafety@springernature.com |
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