IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials

Proceedings of the IUTAM Symposium held in Beijing, China, June 27-30, 2005

280 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

Mechanical Behaviors of Nanocrystal Materials.- Mesoscopic Modeling of the Deformation and Fracture of Nanocrystalline Metals.- Dislocation-Assisted Grain Growth in Nanocrystalline Copper under Large Deformation.- Microstructure and Tensile Strength of Cu with Nano-Scale Twins.- Microstructural Evolution in Crystalline Metal Induced by Plastic Deformation.- Super-Strength and Ductility of Nano-Thin Films.- The Origin of Superhardness in Nanocomposite Coatings: Analysis of Nanoindentation and Scratch Tests.- Micromechanics of Nanocomposites with Interface Energy Effect.- Measurements and Simulations of Interface Behavior in Metal Thin Film Peeling Along Ceramic Substrate.- Micro-Cantilevers for Thin Films: Young's Modulus.- Nanomechanics of Biomaterials.- Bio-Inspired Mechanics of Bone-Like Hierarchical Materials.- Force Unfolding Single RNAs: From Equilibrium to Far-From Equilibrium.- Modelling the Thermal Conductivity of Nanofluids.- Mechanical Behaviors of Carbon Nano-Tube, Nano-Wire, Nano-Layers.- A Comparison of Different Interatomic Potentials: Radius Effect of Single Wall Carbon Nanotubes.- Shape Memory Effect and Pseudoelasticity in Cu Nanowires.- Instabilities of Carbon Nanotubes Studied Using a Hybrid Atom/Continuum Approach.- Shallow and Deep Nanoindentation on W/NbN Nanolayers.- Micro-Mechanics Models and Simulation for the Nanostructured Materials.- Cluster Statistical Thermodynamics (CST) - To Efficiently Calculate Quasi-Static Deformation at Finite Temperature Based on Molecular Potential.- On the Size of the Representative Volume Element for Isotropic Elastic Polycrystalline Copper.- Atomistic Corroboration of a Multiscale Approach for the Analysis of Dislocation Nucleation at a Surface Step.- Indenter Tip Radius and Micro-Indentation Hardness.-Mechanical Behaviors of Other Nano-Materials.- The Phase Angle of an Interface Crack Induced by Indentation Delamination with Buckling.- Microscopic Shape Memory and Superelastic Effects and Their Novel Tribological Applications.- Dynamics of Self-Organized Epitaxial Island Formation under Controlled Annealing.- Studying Visco-Plasticity of Amorphous Polymers by Indentation Tests.- Phase Transitions of Carbon Materials under High Pressure.

• Reihe: Solid Mechanics and Its Applications
• Themen: Technologie, Ingenieurswissenschaft, Landwirtschaft, Industrieprozesse Elektronik, Nachrichtentechnik Elektronik
• ISBN: 9789048174119
• Sprache: Englisch
• Erscheinungsdatum: 30.11.2010
• Größe: 235 x 155 mm
• Verlag: Springer
• Herausgegeben von: Y. G. Wei, Y. L. Bai, Q. S. Zheng