Advances in Condition Monitoring and Structural Health Monitoring

WCCM 2019

795 Seiten, Taschenbuch

Kurzbeschreibung des Verlags

This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019. The contents focus on digitalisation for condition monitoring with the emergence of the fourth industrial revolution (Industry 4.0) and the Industrial Internet-of-Things (IIoT). The book covers latest research findings in the areas of condition monitoring, structural health monitoring, and non-destructive testing which are relevant for many sectors including aerospace, automotive, civil, oil and gas, marine, and manufacturing industries. Different monitoring systems and non-destructive testing methods are discussed to avoid failures, increase lifespans, and reduce maintenance costs of equipment and machinery. The broad scope of the contents will make this book interesting for academics and professionals working in the areas of non-destructive evaluation and condition monitoring.

• Reihe: Lecture Notes in Mechanical Engineering
• ISBN: 9789811591983
• Sprache: Englisch
• Erscheinungsdatum: 03.02.2021
• Genre: Technik/Maschinenbau, Fertigungstechnik
• Verlag: Springer Singapore
• Herausgegeben von: Len Gelman, Nadine Martin, Andrew A. Malcolm, Chin Kian (Edmund) Liew