Proceedings of the 4th International Symposium on Plasma and Energy Conversion

ISPEC 2022, 14-16 Oct, Foshan, China

538 Seiten, Hardcover

Kurzbeschreibung des Verlags

These proceedings highlight the fundamental researches and up-to-data developments on energy conversion and high-voltage application by means of low temperature and atmospheric pressure plasma. In recent years, plasma-assisted energy conversion gains increasing attention as an alternative to thermal-catalysis or electro-catalysis. These proceedings discuss and exchange cutting-edge scientific innovations and technological advances in fields like plasma-enabled synthesis of chemicals and fuels, plasma-enabled the environmental clean-up, plasma-enabled catalysis treatment, in-situ probing of plasma-catalyst interactions and its high-voltage applications, which show great potentials in industrial demands like CO2  hydrogenation, CH4  reforming and nitrogen fixation, plasma deposition, chemical synthesis, VOC abatement and high-voltage insulation.

This collection of papers presents the main applications of plasma-induced energy conversion and high-voltage discharge in the form of separate chapters, including cutting-edge studies on conversion technology, complex mechanism simulation, in-situ detection and converged applications by artificial intelligence.   These proceedings are suitable for researchers engaged in fields like plasma-catalysis, discharge diagnosis and modelling, chemical modelling and high-voltage applications. The major topics covered in the conference proceedings are: 1)     Advanced plasma-catalysis conversion technology; 2)     Advanced in-situ discharge diagnosis technology; 3)     Advanced in-situ plasma-catalysis characterization; 4)     Multi-scale or innovative modelling technology; 5)     High-voltage discharge and application.

• Reihe: Springer Proceedings in Physics
• Themen: Mathematik und Naturwissenschaften Physik Materialwissenschaft / Aggregatzustände Plasmaphysik
• ISBN: 9789819915750
• Sprache: Englisch
• Erscheinungsdatum: 22.04.2023
• Größe: 23.5 x 15.5 cm
• Verlag: Springer Singapore
• Herausgegeben von: Dong Dai, Cheng Zhang, Zhi Fang, Xinpei Lu